Sign Up for the Grant Gazette

5 Grant Gotchas - Header CTA - Hello Bar

Along the top of the site, you will see a "call to action." It's an orange bar.

  • By submitting this form, you agree to our Privacy Policy.
  • This field is for validation purposes and should be left unchanged.

There is grant money waiting for YOU!

BUT if you step in a “grant trap,” your application is a NO! Learn the FIVE most common errors to AVOID in government grants! Get the 5 Grant Gotchas now to save you countless hours.

  • This field is hidden when viewing the form
  • By submitting this form, you agree to our Privacy Policy.
  • This field is for validation purposes and should be left unchanged.

Canadian Compound Semiconductors and Advanced Packaging: Partnering visit to the United Kingdom

Closed to applications

Value

Varies

Description

The visit is designed to increase awareness of research and development (R&D) strengths and collaborative opportunities available within the UK market. It will focus on building Canada-UK research and co-innovation partnerships in chip design and accelerating the development, manufacture, packaging and applications of compound semiconductors.

Interested small- and medium-sized enterprises (SMEs) must be capable and ready to pursue joint R&D collaborations, with the goal of future commercialization, such as:

  • validation of Canadian technologies in the UK market
  • adaptation of Canadian technologies to meet British and global market needs
  • co-development of new products and/or services combining Canadian and UK research and technologies

Eligible Applicants

Canadian delegates should meet the requirements below to benefit from this initiative:

  • profit-oriented small or medium-size enterprise incorporated in Canada
  • previous experience in commercializing technology for domestic or international markets
  • capacity and interest to co-develop technology with UK partners
  • committed to expansion to the UK market
  • sufficient working capital and human resources to undertake a multi-year R&D collaboration and commercialize the results

Eligible Expenses

The Canadian International Innovation Program (CIIP) may provide financial support to eligible Canadian SMEs for 50% of all eligible expenses that include but are not limited to the following:

  • Economy class airfare
  • Local transportation
  • Accommodation
  • Meals (per diems)
  • Conference registration fees

Deadline Date

Interested companies must apply by Friday December 6, 2024.

Contact

Contact Name: CIIP webpage or CIIP

E-mail Address: innovation@international.gc.ca

Website: https://www.tradecommissioner.gc.ca/funding-financement/ciip-pcii/can-semi-advanc-pack-uk_semi-cond-ru.aspx?lang=eng

Industry:

Export, Software/Technology

Location:

Alberta, British Colombia, Manitoba, Newfoundland, Nova Scotia, Nunavut, NWT, Ontario, Quebec, Saskatchewan, Yukon

Tags:

Business, R&D, Semiconductors, SMEs

I’m going to let you in on a secret: You don’t have to waste countless hours or drown in paperwork to win grants

With ABG, you can find the right grants, prepare for your meeting, and write a winning application that will get you the most money, in the least amount of time.

Contact Alberta Business Grants right now.

Grants

Learn more

Join the Weekly Newsletter

5 Grant Gotchas - Header CTA - Hello Bar

Along the top of the site, you will see a "call to action." It's an orange bar.

  • By submitting this form, you agree to our Privacy Policy.
  • This field is for validation purposes and should be left unchanged.

Contact

1-780-297-6177

davidk@albertabusinessgrants.ca

Linkedin Youtube

Alberta Business Grants
Edmonton, Alberta
Canada

© Copyright 2025 | Alberta Business Grant Ltd | All Rights Reserved | Privacy Policy