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Canadian Compound Semiconductors and Advanced Packaging: Partnering visit to the United Kingdom

December 6, 2024

Value

Varies

Description

The visit is designed to increase awareness of research and development (R&D) strengths and collaborative opportunities available within the UK market. It will focus on building Canada-UK research and co-innovation partnerships in chip design and accelerating the development, manufacture, packaging and applications of compound semiconductors.

Interested small- and medium-sized enterprises (SMEs) must be capable and ready to pursue joint R&D collaborations, with the goal of future commercialization, such as:

  • validation of Canadian technologies in the UK market
  • adaptation of Canadian technologies to meet British and global market needs
  • co-development of new products and/or services combining Canadian and UK research and technologies

Eligible Applicants

Canadian delegates should meet the requirements below to benefit from this initiative:

  • profit-oriented small or medium-size enterprise incorporated in Canada
  • previous experience in commercializing technology for domestic or international markets
  • capacity and interest to co-develop technology with UK partners
  • committed to expansion to the UK market
  • sufficient working capital and human resources to undertake a multi-year R&D collaboration and commercialize the results

Eligible Expenses

The Canadian International Innovation Program (CIIP) may provide financial support to eligible Canadian SMEs for 50% of all eligible expenses that include but are not limited to the following:

  • Economy class airfare
  • Local transportation
  • Accommodation
  • Meals (per diems)
  • Conference registration fees

Deadline Date

Interested companies must apply by Friday December 6, 2024.

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There is grant money waiting for YOU! BUT if you step in a “grant trap,” your application is a NO! Learn the FIVE most common errors to AVOID in government grants! Get the 5 Grant Gotchas now to save you countless hours.

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